发明名称 |
A METHOD OF MAKING A WAFER-PAIR HAVING SEALED CHAMBERS |
摘要 |
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited layer on its external surface. The deposition of the layer may be performed in a very low pressure environment, thus assuring the same kind of environment in the sealed chamber. The chamber may enclose at least one device such as a thermoelectric sensor, bolometer, emitter or other kind of device. The wafer-pair typically will have numerous chambers, with devices, respectively, and may be divided into a multiplicity of chips. |
申请公布号 |
WO9950913(A1) |
申请公布日期 |
1999.10.07 |
申请号 |
WO1999US06890 |
申请日期 |
1999.03.30 |
申请人 |
HONEYWELL INC. |
发明人 |
WOOD, R., ANDREW;RIDLEY, JEFFREY, A.;HIGASHI, ROBERT, E. |
分类号 |
G01J1/02;B29C43/56;B81B1/00;H01L27/16;H01L37/02;(IPC1-7):H01L27/16 |
主分类号 |
G01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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