| 摘要 |
PURPOSE:To obtain a semiconductor device which can enhance reliability by restraining the corrosion, of an aluminum interconnection in a pad part for a semiconductor element, which is caused by moisture which creeps through a sealing resin. CONSTITUTION:A protective-film opening region 11 which is used as a pad part for a semiconductor element and in which an aluminum interconnection 2 is exposed is covered wholly with a gold ball 5 bonded to the protective-film opening region 11. Consequently, even when the title semiconductor device is sealed with a resin after a wire bonding operation, moisture which creeps through the resin does not reach the aluminum interconnection 2 in the protective-film opening region 11, it is possible to restrain the corrosion due to moisture of the aluminum interconnection 2 and it is possible to prevent a disconnection or the like from being caused. |
