| 摘要 |
There is provided a conductive filler with high heat resistance which can be melt-bonded under reflow heat treatment conditions for a lead-free solder and, after the bonding, does not melt under the same heat treatment conditions. The conductive filler is characterized in that , as measured by differential scanning calorimetry, it has at least one metastable metal alloy phase observed as an exothermic peak and has at least one melting point observed as an endothermic peak in each of the 210 to 240°C range and the 300 to 450°C range, and that the filler, upon heat treatment at 246°C, gives a bonded object which has, as measured by differential scanning calorimetry, no melting point observed as an endothermic peak in the 210 to 240°C range or has a melting endotherm calculated from an endothermic peak area in the 210 to 240°C range, the melting endotherm being 90% or less of the melting endotherm of the filler before bonding calculated from an endothermic peak area in the 210 to 240°C range. |
