发明名称 STRESS DISTRIBUTION ANALYSIS SYSTEM
摘要 <p>PURPOSE:To predict stress and displacement after molding with a metal die and to design the metal die on a computer without repeating an experiment and a test concerning the stress distribution analysis system for analyzing the stress distribution of a shape to be molded by the metal die. CONSTITUTION:This system is provided with a rigidity matrix generation part 7 for generating a rigidity matrix K to be decided by a Young's modulus and a Poisson modulus specific to a designated material for each divided element, load vector generation part 8 for generating a load vector P to be impressed to the surface of an object on designated border conditions, and stress vector calculation part 9 for calculating a stress vector sigma to be stocked at each element corresponding to a displacement vector (u) of each element calculated from these generated load vector P and rigidity matrix K, and the calculated displacement vector (u) and stress vector sigma for each element are outputted.</p>
申请公布号 JPH06119418(A) 申请公布日期 1994.04.28
申请号 JP19920269896 申请日期 1992.10.08
申请人 FUJI ELELCTROCHEM CO LTD 发明人 MASUDA YASUYUKI;SAWAKE TAKESHI;SAWADA IKUO;MAEDA TAKEO
分类号 G06F17/50;G06F19/00;(IPC1-7):G06F15/60;G06F15/20 主分类号 G06F17/50
代理机构 代理人
主权项
地址
您可能感兴趣的专利