Semiconductor chip mounting arrangement for fragile semiconductor element - includes silicon rubber encapsulation on all sides of chip within plastics package

摘要

A semiconductor chip (6) which is within a plastics package and an elastic material (3,5) is used to encase the semiconductor chip on all sides. Pref. the semiconductor chip is attached to a carrier strip (2) via a silicon rubber chip adhesive (3), which extends around the chip side edges. The bonding wire connections are provided before the top surface of the coated with a silicon rubber (6) which flows around the chip edges. ADVANTAGE - Tension-free assembly allows use of relatively cheap plastics housing.