| 摘要 |
<p>PROBLEM TO BE SOLVED: To form wiring conductors at a high density and surely and tightly electrically connect semiconductor elements and capacitor elements to the wiring conductors by providing dummy pads facing bonding pads on the bottom of a topmost org. resin insulation layer. SOLUTION: Org. resin insulation layers 2 and thin film wiring conductors 3 are alternately laminated to form a multilayer wiring 4 provided with bonding pads 7 on the top surface of the topmost org. resin insulation layer 2a. The pads 7 are electrically connected to the wiring conductors 3. On the bottom surface of the topmost org. resin insulation layer 2a, dummy pads 8 facing the bonding pads 7 are disposed to effectively block the topmost insulation layer 2a from being recessed, thereby surely and tightly electrically connecting the electrodes of active components such as semiconductor elements and passive components such as capacitor elements and resistor elements to the bonding pads 7.</p> |
