发明名称 |
Apparatus and method for applying process solution |
摘要 |
A process solution applying apparatus comprising a substrate holding mechanism for holding a substrate, a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, the process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied, and a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution.
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申请公布号 |
US2001037763(A1) |
申请公布日期 |
2001.11.08 |
申请号 |
US20010905504 |
申请日期 |
2001.07.12 |
申请人 |
DEGUCHI MASATOSHI;YOSHIHARA KOSUKE |
发明人 |
DEGUCHI MASATOSHI;YOSHIHARA KOSUKE |
分类号 |
B05C11/08;G03F7/16;H01L21/00;H01L21/027;(IPC1-7):H01L21/00 |
主分类号 |
B05C11/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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