发明名称 AUTOMATIC MOLDING METHOD
摘要 PURPOSE:To enable a wafer to be given with uniform polishing ability by employing porous material as an attraction face and impregnating the annular outer peripheral section of an attraction face with a soft elastic body for sealing in attraction. CONSTITUTION:When an automatic valve 9 is opened, an automatic valve 10 is closed, and vacuum sources 5 and 7 are actuated, a porous material 1 and annular section channel 6 become decompression state attracting a wafer 11. The wafer 11 is attracted in the hole section 6 of an annular member 2 made of porous material impregnated with a soft elastic body to be firmly stuck with the soft body. When the automatic valve 9 is closed, and the automatic valve 10 is opened after machining, vacuum sections 5 and 7 are stopped, and a pressured water source 8 is actuated, a pressured water gushes from the channel section 6 to the wafer 11 removing the 11 from the porous material 1 and completing machining.
申请公布号 JPH0671689(B2) 申请公布日期 1994.09.14
申请号 JP19850264802 申请日期 1985.11.27
申请人 发明人
分类号 H01L21/683;B23Q3/08;B24B37/04;B24B37/30;B24B41/06;H01L21/304;H01L21/67;H01L21/68 主分类号 H01L21/683
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