Integrated circuit packaging system with surface treatment and method of manufacture thereof

摘要

An integrated circuit packaging system, and a method of manufacture thereof, includes: an embedded trace substrate having bonding sites and traces embedded in a base material, an insulation layer on the traces, the insulation layer having a top surface coplanar with the top surface of the base material; and an integrated circuit die connected to the bonding sites.

主权项

1. A method of manufacture of an integrated circuit packaging system comprising:
providing a base embedded trace substrate having traces and bonding sites embedded in a base material, the bonding sites lower than a top surface of the base material; forming a mask over the bonding sites; forming an insulation layer on the traces, the insulation layer having a top surface coplanar with a top surface of the base material; removing the mask; and connecting an integrated circuit die to the bonding sites; andwherein:
forming the insulation layer includes forming the insulation layer on the bonding sites.