PACKAGE BOARD, SEMICONDUCTOR PACKAGE AND FABRICATING MEHTOD THEREFORE,申请号KR20050094546-传众专利搜索

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发明名称	PACKAGE BOARD, SEMICONDUCTOR PACKAGE AND FABRICATING MEHTOD THEREFORE
摘要
申请公布号	KR100711966(B1)	申请公布日期	2007.04.20
申请号	KR20050094546	申请日期	2005.10.07
申请人	SAMSUNG ELECTRO-MECHANICS CO., LTD.	发明人	KIM, SEUNG GU;YOO, JE GWANG;LEE, YONG BIN;WEE, YOO KEUM;HUH, SEOK HWAN;RYU, CHANG SUP
分类号	H01L23/12	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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