SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which is improved in reliability while reducing the size of a chip. SOLUTION: A semiconductor device 100 has an I/O circuit 14. The I/O circuit 14 has an I/O pad 22, that is formed on an interlayer insulating film 40 positioned on the element-forming region of a semiconductor substrate. The I/O pad 22 has laminated via structure 20, that is composed of first and second electrode pads 32 and 34 and a via 36 for connecting the first electrode pad 32 to the second pad 34.