| 摘要 |
PROBLEM TO BE SOLVED: To form a solder bump fully placed on the surface of a projection electrode even if a Pb free solder of low wettability is used, in forming a solder bump on the projection electrode protruding from the surface of an electronic component, using a metal mask for solder paste printing. SOLUTION: A metal mask 10 for printing a solder paste 30 is used for forming a solder bump 31 on a projection electrode 21 that projects from the surface of an electronic component 20. The mask comprises an opening 11 whose position corresponds to the projection electrode 21. A part of the periphery of opening 11 is an extended part 12 so extending as to be placed on the projection electrode 21. The opening 11 is positioned above the projection electrode 21 as the extended part 12 of the opening 11 is placed on the projection electrode 21 when the metal mask 10 is attached to the electronic component 20. COPYRIGHT: (C)2006,JPO&NCIPI
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