| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing an inexpensive fine pad which has a high insulating property and can be manufactured at a low cost and can be easily contacted by a probe to measure electrical characteristics of a device designed and manufactured by the 0.25μm or 0.18μm rule which is today's main stream. SOLUTION: The method of manufacturing the pad comprises a step of polishing the surface layer of the surface of a semiconductor chip including a portion to be measured for electrical characteristics, to such a degree that there may be no interconnection layer above the portion to be measured for electrical characteristics; a step of determining a range to form the pad above the portion to be measured for electrical characteristics and then milling the range; a step of milling a contact hole for forming a contact plug for connecting the portion to be measured for electrical characteristics and the pad; a step of depositing a metal in the milled portion; and a step of flattening the surface of the pad by polishing the surface of the deposited portion. By this manufacturing method, the embedded pad can be obtained which has little irregular reflection and can be accurately grasped in its position and shape and is hardly destructed when being contacted by the probe. COPYRIGHT: (C)2006,JPO&NCIPI
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