| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus which can suppress an influence of stress on a non-heat generator and is applicable even if lead-free solder is used for mounting, in an electronic apparatus wherein a substrate with heat generators and non-heat generators mounted is fixed to a heat sink by means of a thermal conductive oil between the heat sinks. SOLUTION: A seat 12 having a plurality of convexes 12a and 12b is provided at a position for fixing a metal substrate 13 in a heat sink 11 constituting an electronic apparatus, and the metal substrate 13 is secured to the convex 12b by screws 15 in a state where a silicone grease 14 is interposed between the convex 12a and the metal substrate 13. A recess 20 which the silicone grease 14 can enter is provided at a position corresponding to the non-heat generator 17 between the metal substrate 13 and the heat sink 11. COPYRIGHT: (C)2007,JPO&INPIT |
