| 摘要 |
Disclosed is a semiconductor device molding apparatus which can sufficiently reduce void formation inside a formed semiconductor mold. The semiconductor device molding apparatus comprises: a first metal mold having a first mold cavity to perform a molding process on a first substrate having semiconductor devices installed therein; a second metal mold having a second mold cavity to perform a molding process on a second substrate having the semiconductor devices installed therein; a port block arranged between the first and second metal molds, and having at least one first port and at least one second port to inject a molding resin to the first and second mold cavities, respectively; and a curl block arranged in an upper part of the port block, and having first and second gates to inject the molding resin to the first and second mold cavities, respectively, from the first and second ports. |
