| 摘要 |
A method for producing a wired circuit board is disclosed in which a wire mat is first formed on a fixture (10) and then mated with a circuit board (176) having a specified conductive pad layout on the board surface. A continuous wire is routed on a fixture (10) along a predetermined path over a thermoplastic adhesive layer (62) and the wire is adhered to the layer to fixably position the wire in the routed configuration. The continuous wire is severed at selected locations to form a plurality of wire nets. A wire mat thus formed is mated with a circuit board (176) having conductive pads disposed on the board surface such that selected points of selected wires confront selected conductive pads on the circuit board. After removal from the fixture (10), compressive pressure is applied to the wire mat and circuit board to conformally adhere the wire mat to the circuit board. The circuit board and wire mat adhered thereto are next heated at elevated temperature to cure the adhesive layer. Selected points of wires confronting conductive pads on the circuit board are then soldered to the respective pads to complete interconnection of predetermined conductive pads on the circuit board thereby yielding a wired circuit board adapted to receive integrated circuit and other electrical components. A wire mat produced in the disclosed manner may be applied to one or both circuit board surfaces. |
