| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device module, having a structure which can accelerate both the size reduction and thickness reduction of a device. SOLUTION: This module has a 1st lead frame 1-1, having a mount part 1a where a control semiconductor element 3 is mounted and a connection part 1c, which is connected to a protection electrode 8 of a power semiconductor element 2 and a 2nd lead frame 1-2, having a mount part lb where the power semiconductor 2 is mounted and a connection part 1d, which is connected to a projection electrode 8 of the control semiconductor element 3. Then the projection electrode 8 of the power semiconductor element 2 and the projection electrode 8 of the control semiconductor element 3 are electrically connected to each other, while overlapping with each other and in this state, and they are sealed with a sealing member 6. |
