| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a semiconductor module having no environmental load in order to solve the problem that a semiconductor device which is obtained by using a lead frame or a transfer mold has many portions where materials are discarded, and making no load applied to an environment. <P>SOLUTION: A wound-up plate-like lead 20 is prepared and pressed to prepare plate-like leads 5, and the leads 5 are held to be fixed to semiconductor elements. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
