| 摘要 |
A process for bonding chip devices to hybrid circuitry including the steps of: 1) prewetting the chips by scrubbing in a gold-silicon solder lake at 400 DEG C, 2) heating the substrate to eutectic temperature of 377 DEG C, 3) positioning the chips on the gold land of the substrate, 4) pushing the chips onto the substrate to overcome the surface tension and cause the solder to flow, completely wetting the chip and substrate.
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