Prodn. of conductor frames for semiconductor components

摘要

A process is claimed for the prodn. of conductor frames for semiconductor components, with a bonding island, inner and outer contact connections and retaining strips. The process comprises coating a film of polyamide-acid (I) directly onto the back of the bonding island and then converting (I) into a bonding polyimide film by thermal compression with a heat generator at 350-420 deg C.