SEMICONDUCTOR ELEMENT AND ITS FORMATION

摘要

PURPOSE: To provide a semiconductor element and a method for forming the same which has realized reduction in manufacturing cost and shortening of the manufacturing time. CONSTITUTION: A substrate 11 has a conductive trace 12 and a bonding pad 13 on the bottom surface, and also has a conductive trace 14 and a semiconductor chip fitting pad 17 on the upper surface. A substrate supporting section 22 has an aperture and is coupled with the substrate 11. A semiconductor chip 31 is coupled with the semiconductor chip fitting pad 17. The semiconductor chip 31 is covered with a sealing material 38 or a cap for the protection.