| 摘要 |
PROBLEM TO BE SOLVED: To prevent cracks in solder bump joints between electrodes of a semiconductor element and connection patterns formed on a substrate by filling corners formed by side faces of the semiconductor element and a mounting face of the substrate with an adhesive. SOLUTION: Solder paste is printed on connection patterns 31 of a substrate 30 and then bumps 22 of electrodes 21 of a semiconductor element 20 are mounted on the printed solder paste with the bumps and the connection patterns 31 being aligned with each other. Thereafter, the substrate 30 is introduced into a reflow furnace to melt the solder paste and electrically connect the electrodes 21 of the semiconductor element 20 and the connection patterns 31 of the substrate 30, forming solder joints between the electrodes 21 of the semiconductor element 20 and the connection patterns 31 of the substrate 30. The corners formed by side faces of the semiconductor element 20 and a mounting face of the substrate 30 are filled with an adhesive to form reinforcing sections 23. Due to this structure, cracks can be prevented from being generated in the solder bump joints. |
