| 摘要 |
PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus which can deposit a film of nearly uniform thickness on a member to be vapor-deposited by weakening the directivity of an evaporation material to be emitted on the member to be vapor-deposited. SOLUTION: The vapor deposition apparatus has such constitution that an evaporation material guide pipe and a member for emission are maintained at a predetermined temperature, the evaporation material inside thereof forms a rarefied flow, an emission nozzle to emit the evaporation material onto a glass substrate 1 is protruded from an upper surface of a container for emission, and an orifice member to diffuse the evaporation material is provided on a front edge side of the emission nozzle. By satisfying an inequalityϕD'/ϕD≤0.8, whereinϕD is the diameter of the emission nozzle, andϕD' is the diameter of the orifice member, the evaporation material is emitted according to the cos<SP>n</SP>θlaw with n being≤6, the directivity of the evaporation material emitted from the orifice member is weakened, and uniformity of the film thickness distribution on the glass substrate can be thereby enhanced. COPYRIGHT: (C)2006,JPO&NCIPI
|
