| 摘要 |
PURPOSE:To provide a semiconductor device with a reduced chip size, standard ized cell size and improved design efficiency by changing the layout of bonding pads on a semiconductor substrate. CONSTITUTION:Along the sides of a main face of a semiconductor substrate 11, pads 12 are formed which are arranged at specified thickness and pitch from these sides, leads 13 face at the sides of the substrate and are electrically connected to the pads by wires 14. A peripheral region B of the substrate has corner parts C. The thickness of one pad disposed near the part C from the nearest side of the substrate is greater than that of other pad disposed at or near the center of said side. If the pads are disposed in this way, the pitch of the pads disposed at and near the parts C can be equal to or greater than that of those disposed at or near the center of said nearest side whereby the wires never contact with each other. |
