COIN-PLATED DEVICE

摘要

The present invention relates to a device for plating a coin, including a plating tank filled with an electrolyte and a pair of a negative electrode and a positive electrode arranged to be parallel across the plating tank, comprises a coin receiving unit in which a to-be-plated target receiving part accommodating a to-be-plated target is installed in the positive electrode in a conductive manner and coins charged not to overlap each other when the negative electrode is inclined in a state of not being fully filled with coins are guided to roll and electrically connected with the negative electrode. According to the present invention, both front and rear sides of coins can be uniformly plated, enhancing plating quality.