| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which is excellent in flame retardance and resistance to soldering heat through it does not contain a halogenated organic compound and antimony oxide as flame retardants. SOLUTION: This composition, for semiconductor sealing, contains (A) an epoxy resin represented by formula (1) (each R1 is a 1-4C alkyl; each (a) is an integer of 0-3; each R2 is a 1-4C alkyl; each (b) is an integer of 0-4; and (n) is an average, being 1-10), (B a phenol resin represented by formula (2) (each R3 is a 1-4C alkyl; each (c) is an integer of 0-3; each R4 is a 1-4C alkyl; each (d) is an integer of 0-4; X is a residue formed by removing two hydrogen atoms from benzene or naphthalene; R5 is H, a 1-4C alkyl, or hydroxyl; and (l) and (m) are each an average, each being 1-10), (C) a cure accelerator, and (D) a fused silica powder in an amount of 85-93 wt.% based on the composition.
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