| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition having such properties that smear in a recessed portion can be reliably removed regardless of types of lasers used and that a resist layer can be reliably removed after a plating catalyst is imparted.SOLUTION: The curable resin composition is to be used for forming a resist layer in a method for manufacturing a printed wiring board which includes steps of forming the resist layer over a curable resin layer on a surface of a substrate, forming a recessed portion in the resist layer and in the curable resin layer from the resist layer side, imparting a plating catalyst to the surface of the resist layer surface and to the surface of the recessed portion, removing the resist layer together with the plating catalyst on the surface thereof, and subjecting the surface of the recessed portion to electroless plating. The composition comprises an alkali-soluble resin and a curable component.SELECTED DRAWING: Figure 2 |
