| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring substrate in high mass productivity capable of meeting the wiring miniaturization and also multilayer wiring. SOLUTION: In a manufacture constituted of the three steps mentioned as follows; i.e., the first step (a) of directly forming an insulating layer 120 on a base substrate 110 or on a metallic wiring layer 130 provided on the base substrate, the second step (b) of transfer step of transfer-forming a plating- formed metallic wiring layer 130 provided on a plated board 140A on the base substrate 110 through an intermediary of the insulating layer 120, the third step (c) of setting the insulating layer 120 after the transfer, the insulating layer 120 is to be exposed in the temperature exceeding the highest temperature out of the 5% reduced thermal cracking temperature of the insulating layer 120 exposed for the wiring substrate manufacture, also the storage elastic modulus is not to exceed 1×10' dyne/cm<2> at the exposed temperature by the processing before the setting step. |
