| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for manufacturing a semiconductor device, wherein the power consumption of a dry pump is reduced for lower running cost related to a semiconductor manufacturing device comprising a plurality of vacuum reaction vessels and vacuum exhaust devices. SOLUTION: In processing a semiconductor substrate, a vacuum exhausting pump, especially dry pumps 31, 32, and 33, for a vacuum reaction vessel which requires no continuous vacuum exhausting is stopped appropriately. Stopping of pump driving reduces power consumption for lowering the running cost. After a wafer cassette has been set at a cassette chamber 11 for pre-exhausting by the dry pump 31 connected to the cassette chamber, a semiconductor wafer is transported by a transportation robot, and here a transportation robot chamber 13 is also required to be kept at a reduced pressure, so that exhausting is continued by the dry pump 32 connected to the transportation robot chamber. |
