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发明名称
METHOD FOR BONDING SEMICONDUCTOR CHIP
摘要
申请公布号
JPH0661304(A)
申请公布日期
1994.03.04
申请号
JP19920209888
申请日期
1992.08.06
申请人
NEC CORP
发明人
SENBA NAOHARU
分类号
H01L21/60;H05K3/30;H05K3/34;(IPC1-7):H01L21/60;H01L21/52
主分类号
H01L21/60
代理机构
代理人
主权项
地址
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