LAYING APPARATUS FOR CHIP PARTS OF MULTIMOUNT

摘要

The unit is designed effectively to lay down the chip devices inside of the template. The unit comprises; a sensor (60) monitoring the template state in support layer; a program logic control (PLC) outputting high and low signal according to the sensor output; multi-vibrators (3-1,3-2) outputting the vibration period by PLC output; air-cylinders (40,50) taking straight movement with the vibration period input; a chip device (8) inside a template (30).