发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a low-threshold high-performance semiconductor device and its manufacturing method. SOLUTION: The semiconductor device 1 has a CMOS on the surface of a silicon substrate 10. Its PMOS 1 has a gate electrode G4 formed by depositing polycrystalline silicon 21 on tungsten which surface has been treated with tungsten nitride, and its NMOS 1 has a gate electrode G2. A tungsten thin film is reacted with tungsten silicide 23 by a heat treatment after forming polycrystalline silicon 21 on the tungsten thin film to shift the work function of the gate electrode G2 to that of the gate electrode G4. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006156807(A) |
申请公布日期 |
2006.06.15 |
申请号 |
JP20040346957 |
申请日期 |
2004.11.30 |
申请人 |
TOSHIBA CORP |
发明人 |
SAITO TOMOHIRO;SUGURO KYOICHI |
分类号 |
H01L27/092;H01L21/8238;H01L29/423;H01L29/49;H01L29/786 |
主分类号 |
H01L27/092 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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