发明名称 MANUFACTURE OF SPUTTERING TARGET
摘要 A manufacturing method of a target for sputtering comprises the steps of: compressing first and second oxide powders with high permeability to form first and second compressed materials, respectively; sintering the first and the second compressed materials to form a sintered body made of a third oxide crystal; pulverizing the sintered body made of the third oxide crystal to form a third oxide powder; mixing the third oxide powder and titanium powder and compressing the mixed powder to form a third compressed material; and sintering the third compressed material in a vacuum condition to form an oxide target. This manufacturing method produces a target which can stably form oxide thin film with high permeability at high voltage for a long time and can be applied to a direct current sputtering process.
申请公布号 JPH0849071(A) 申请公布日期 1996.02.20
申请号 JP19950143592 申请日期 1995.06.09
申请人 SAMSUNG ELECTRON CO LTD 发明人 HAKU CHIYUURETSU
分类号 C04B35/00;C01F11/06;C22C32/00;C23C14/34;C30B23/00;H01L21/203;H01L21/363 主分类号 C04B35/00
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