| 摘要 |
PURPOSE:To manufacture a package-type semiconductor device having a heatsink by which the heat of a semiconductor chip is radiated and which is buried in the synthetic resin package unit of the semiconductor chip with a low defect ratio and at a low cost. CONSTITUTION:An island part 11 and a plurality of lead terminals 13 are formed in a lead frame 10. After the die-bonding of a semiconductor chip 14 onto the island part 11 and wire bondings between the semiconductor chip 14 and the respective lead terminals 13 are finished, the lead frame 10 is held between a pair of molds 16 and 17. A heatsink 20 is provided in one (19) of the cavities 18 and 19 of the respective molds 16 and 17 which corresponds to the lower surface side of the island part 11 and, in this state, the cavities 18 and 19 are filled with melted synthetic resin. |
