METHOD OF MAKING PACKAGE FOR ELECTRONIC PART

摘要

PURPOSE: A package making method is provided to be capable of preventing an outer air from flowing in via a hole by filling the hole using a conductive material and printing a pattern on upper and lower surfaces of a substrate and a hole portion. CONSTITUTION: A substrate having a hole is processed(S1). A conductive material is printed at the hole of the substrate by a print manner, and are dried and sintered at a predetermined temperature(S2). A pattern is printed, dried and sintered on an upper surface of the substrate(S3), and a pattern is printed, dried and sintered on a lower surface of the substrate(S4). A bare chip is attached on the upper surface of the substrate and wires are bonded(S5). A sealing process is performed using an adhesive after attaching leads(S6).