| 摘要 |
PURPOSE:To simplify a manufacturing process, and to obtain an internal layer material having high quality by heating and bonding foamed fluoroplastics, in which a thermosetting resin is applied and formed on the side bonded with the internal layer material, onto both surfaces of the internal layer material, dipping the internal layer material in a plating solution, using the foamed fluoroplastics as a resist film and plating the inside of a through-hole. CONSTITUTION:Foamed fluoroplastics 16 in which a thermosetting resin 15 is applied onto a surface on the side bonded with an internal layer material 14 are employed as a resist film 17 for chemical plating, and the inside of a through-hole 11 and a circuit pattern 13 are plated. Since the foamed fluoroplastics 16 contain a large quantity of air, the foamed fluoroplastics display a low dielectric constant between the dielectric constant value of polytetrafluoroethylene itself and the dielectric constant value of air, and chemical resistance thereof is made better than a polyimide resin. Consequently, the chemical resistance of a chemical plating solution is also increased, and the resist film 17 is laminated as it is without being peeled after plating and the whole may be used as a multilayer printed board. Since the foamed fluoroplastics 16 have the excellent electrical characteristics of the low dielectric constant, etc., as an inter-layer insulating layer, the multilayer printed board having high quality can be shaped. |
