| 摘要 |
PURPOSE: To thin a semiconductor device by fixing a semiconductor element to a lead frame by a bonding tape which can be attached and detached and removing a bonding tape after resin-sealing a semiconductor element at the side wherein it is not fixed by a bonding tape and a part of a lead frame after electrically connecting it to a lead frame. CONSTITUTION: A bonding tape 2 is applied to a die-free lead frame 1 having no die mount, and a semiconductor chip 3 is bonded to a specified position of the lead frame 1. Then, an electrode pad part of the semiconductor element 3 and a bonding pad part of the lead frame 1 are connected by a wire 4, a part of a product which requires protection is sealed with resin 5 and the semiconductor chip 3 and the lead frame 1 are fixed. The bonding tape 2 fixing the semiconductor chip 3 and the lead frame 1 is removed, a dam bar for preventing resin from flowing is removed and the lead frame 1 is cut and removed. Thereby, the bonding tape 2 can be readily removed and a semiconductor device can be made thin. |
