| 摘要 |
PURPOSE: A method for drying a wafer by using a difference of surface tension is provided to have no influence on the environment and to prevent a fire, by effectively drying a wafer and by eliminating the need to use organic solvent except deionized water in drying the wafer. CONSTITUTION: The wafer(1) soaked in deionized water consecutively supplied to a process tank at a uniform flow rate, is elevated to the surface of the wafer. Heat is transferred from a heat source(5) installed outside the process tank to the surface of the elevated wafer to make the surface of the wafer maintain a temperature higher than the temperature of the deionized water. The deionized water on the surface of the wafer is eliminated by the difference of surface tension before the wafer is elevated over the surface of the deionized water.
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