发明名称 SENSOR DEVICE AND INSPECTION METHOD THEREOF
摘要 To provide a sensor device which is capable of high temperature detection using self-heat generation without providing a dedicated terminal and suppresses an increase in cost with an increase in chip occupation area due to the addition of a test pad. A sensor device is configured to include an active logic switching circuit for switching an active logic of an output driver and perform a heating inspection while switching the active logic of the output driver during an inspection process with the output driver as a heat generation source.
申请公布号 US2016258995(A1) 申请公布日期 2016.09.08
申请号 US201615058875 申请日期 2016.03.02
申请人 SII Semiconductor Corporation 发明人 HIKICHI Tomoki
分类号 G01R31/28 主分类号 G01R31/28
代理机构 代理人
主权项 1. A sensor device which is configured of a semiconductor device having three terminals as a power supply terminal, a ground terminal, and an output terminal and switches an ON/OFF state of an output driver according to a physical quantity applied to a sensor element, said sensor device comprising: a sensor circuit which outputs a binary sensor output logic signal according to the magnitude of the physical quantity; and an active logic switching circuit which is inputted with the sensor output logic signal and executes switching control for the ON/OFF state of the output driver, wherein the active logic switching circuit switches the logic of the inputted sensor output logic signal according to an active logic switching signal generated thereinside.
地址 Chiba-shi JP
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