| 摘要 |
PROBLEM TO BE SOLVED: To provide a drilling method capable of drilling a via hole in a printed circuit board, in particular, a conformal substrate in a short time using the laser beam. SOLUTION: The Baser beam from a laser beam oscillator 1 is shaped in the rectangular beam by a beam shaping unit 3, and the rectangular beam is scanned over the whole conformal substrate by moving the conformal substrate 6 loaded on an X-Y table 7 in a zigzag manner in the shorter and longer side direction. The drilling time can be reduced thereby. |
