| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device in which the inflow rate of a molten mold resin is uniformized between the top and the bottom of a semiconductor chip and in which voids, wire deformation and pad shift are prevented. SOLUTION: In this resin-sealed semiconductor device, a peripheral portion of a lead frame 11 having a semiconductor chip 12 mounted at the center thereof is held tightly by a upper metal mold 1 and a lower metal mold 2, and a gate 4 is passed into a cavity 3 formed between the upper and lower metal molds 1 and 2 to inject and solidify a heat-melted mold resin, thereby sealing the semiconductor chip 12 with the resin. On the side close to the gate 4 on the lead frame 11, a guide plate 14 which is inclined toward the remaining portion of the lead frame is formed.</p> |
