| 摘要 |
PROBLEM TO BE SOLVED: To provide heat treatment equipment wherein a substrate can be heat-treated by improving in-plane temperature uniformity of the substrate. SOLUTION: This equipment is heat treatment equipment which thermally treats the substrate W to a prescribed temperature and is provided with a heating plate 51 wherein the substrate W is arranged adjacently or mounted and heat-treated, a first region 71 which is arranged facing a substrate arranging surface of the heating plate 51 and in which parts facing the heating plate 51 are arranged concentrically at least on a central part, and a second region 72 arranged outside the first region. Further, the equipment is provided with a ceiling plate 63 having a heat pipe 73 which includes the first region 71 and the second region 72, a surrounding member 62 for surrounding a space S between the heating plate 51 and the ceiling plate 63, air current forming means 66, 67 which form an air current running from the outer periphery of the heating plate 51 to the center of the ceiling plate 63 in the space S, a temperature control mechanism 80 which controls temperature of the first region 71 by controlling temperature of the heat pipe 73 of the ceiling plate 63, and a heating mechanism 75 for heating the second region 72. |
