发明名称 |
SEMICONDUCTOR PACKAGE |
摘要 |
<p>Disclosed is a semiconductor device such as a DIP (Dual In-line Package) or PGA (Pin Grid Alley), which has a plurality of leads protruding only from one surface of a flat package. A single independent lead protrudes from the surface of the package at the position which is aligned with a guide hole formed in the package. The independent lead has a bore which penetrates through the lead lengthwise and connects to the guide hole. A wiring member of an electronic part or the like placed in the bore via the guide hole is soldered to the inner wall of the independent terminal.</p> |
申请公布号 |
KR970005720(B1) |
申请公布日期 |
1997.04.19 |
申请号 |
KR19930015342 |
申请日期 |
1993.08.07 |
申请人 |
TOYOTA JIDOSHAK MFG KK. |
发明人 |
MIYAJAKI, YUKIYASU;SUGITANI, NOBUYOSHI;SHIMOJO. YOSHIAKI |
分类号 |
H01L23/12;H01L23/498;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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