| 摘要 |
PURPOSE:To obtain a package having excellent electrical insulating properties, thermal conductivity, reliability, etc. and high profit ability and difficult to be peeled by specifying the constitution of a base and a cap. CONSTITUTION:A base 10 has a metallic base body 11 with an indentation for loading a chip 40, a ceramic layer 13 formed onto the metallic base body 11 and having electrical insulating properties, a metallic layer 15 patterned and shaped to a predetermined circuit extending over an outer circumferential section from a peripheral section on the ceramic layer 13, and mixed layers 12, 14 each formed near respective interface of the metallic base body 11, the ceramic layer 13 and the metallic layer 15 and including a constituent on both sides of the interfaces. On the other hand, a cap 20 has a box-shaped metallic base body 21, a ceramic layer 23 shaped to a peripheral section on the side opposite to the base 10 of the metallic base body 21 and having electrical insulating properties, and a mixed layer 22 formed near the interface of the metallic base body 21 and the ceramic layer 23 and including both constituents.
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