| 摘要 |
PURPOSE:To make it possible to bond a plural kinds of semiconductor chips on carrier tape, by providing a plurality of bonding means between a feeding reel and a winding reel. CONSTITUTION:A plurality of bonding means 6, e.g., two bonding means, are provided between a feeding reel 3 and a winding reel 4. Semiconductor chips 13 are mounted on rotary tables 9. During the period when carrier tape 1 is wound around the winding reel 4 from the feeding reel 3, two kinds of the semiconductor chips 13 can be bonded to the carrier tape 1.
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