| 发明名称 | MEMS devices, packaged MEMS devices, and methods of manufacture thereof | ||
| 摘要 | MEMS devices, packaged MEMS devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (MEMS) device includes a first MEMS functional structure and a second MEMS functional structure. An interior region of the second MEMS functional structure has a pressure that is different than a pressure of an interior region of the first MEMS functional structure. | ||
| 申请公布号 | US9359194(B2) | 申请公布日期 | 2016.06.07 |
| 申请号 | US201514606951 | 申请日期 | 2015.01.27 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Liang Kai-Chih;Cheng Chun-Wen |
| 分类号 | H01L29/84;B81C1/00;B81B7/02;B81B7/00 | 主分类号 | H01L29/84 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. A method of manufacturing a microelectromechanical (MEMS) device, the method comprising: attaching a MEMS device to a substrate, wherein the MEMS device includes a first MEMS functional structure having a first interior region surrounded by a sealing ring and a second MEMS functional structure having a second interior region surrounded by a second sealing ring having a shallow trench extending from outside the second MEMS functional structure to the second interior region; creating a first pressure in the first interior region of the first MEMS functional structure; and creating a second pressure in the second interior region of the second MEMS functional structure; and sealing the shallow trench to maintain the second pressure in the second interior region. | ||
| 地址 | Hsin-Chu TW | ||