发明名称 |
Simultaneous provision of controlled height bonding material at a wafer level and associated structures |
摘要 |
Different techniques may be used to realize the simultaneous provision of bonding material at a controlled height on a wafer level. These techniques include photolithographically patterning a layer of bonding material and providing spacer elements on a wafer then contacting another surface having the bonding material provided thereon to transfer the bonding material to the spacer elements. The patterning of the bonding material may include using a mask direct contact with or spaced from the bonding material. The providing of the spacer elements may include forming the spacers in the wafer itself or attaching spacer elements, particularly a wafer of spacer elements. The resultant integrated structure has controlled spacing between the bonded elements. |
申请公布号 |
AU9306701(A) |
申请公布日期 |
2002.04.08 |
申请号 |
AU20010093067 |
申请日期 |
2001.09.26 |
申请人 |
DIGITAL OPTICS CORPORATION |
发明人 |
ALAN D. KATHMAN;HARRIS R. MILLER;JAY MATHEWS;STACEY GRABINER;WADDIE HEYWARD |
分类号 |
G02B6/12;G02B6/43;H01L25/16 |
主分类号 |
G02B6/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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