| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of bonding fingers by providing one package cover which connects at least one of a plurality of bonding pads to at least one of a plurality of external connectors. SOLUTION: A semiconductor die bonding pad 422 connected to a platform 400 is connected with a package cover 408, and the cover has an external connector 702. A remaining semiconductor die bonding pad 422 connected to a bonding finger 414 is connected with an external connector 702 on a package case 402. Therefore, the package cover 408 is mounted only physically on the package case 402, and the case has no conductive case pattern. The external connector 702 of the package cover 408 is in close contact and flush with the external connector of the package case 402. Thus, a plurality of bonding pads may be connected to a smaller number of external connectors on the package body. |
