| 摘要 |
PURPOSE:To enable a connection point where a via and a conductive layer are connected together to be easily confirmed through an artwork or the like even if the via is small in diameter by a method wherein a step in which a conductor layer provided with a mark formed on its part connected through the via is made to adhere to an insulator layer is provided. CONSTITUTION:First of all, an artwork operation is carried out basing on design data, and the pattern of a conductor layer which is pasted on an insulator layer is formed into a film. A mark is formed on the film concerned. In succession, the conductor layer is formed on the insulating layer using the film. The insulator layers on which the conductor layer is pasted are laminated, and through-holes are bored in the laminate concerned by a drill or the like. At this point, the mark formed on the conductor layer is eliminated through boring. Thereafter, the through-hole is plated to electrically connect the conductor layers for the formation of a via. Finally, solder resist is applied to form a multilayered printed wiring board. As mentioned above, a mark is provided to a part of a conductor layer which is connected to a via at an artwork stage, so that the part concerned can be easily and visually confirmed. |
