| 摘要 |
<p>PURPOSE:To prevent the steam explosion during the heating step of a package thereby avoiding the package cracking by a method wherein something like projections is provided on the surface of a semiconductor substrate so that gaps is hard to form in the interface between the chip surface and a resin molded body may be prevented to suction-diffuse the water content on the chip surface in a sealing resin. CONSTITUTION:The electrode pads 12 arranged on the periphery of a semiconductor substrate 4 are connected to the leads 5 externally fixed on the periphery through the intermediary of wires 6. Next, the dummy pads 2 provided on the central region of the substrate 4 are connected to one another in arc shape to form something like projections. Next, the chip surface is sealed up with a resin molded body 3 as if covering the dummy pad wires 1. In such a constitution, the excellent bond properties between the chip substrate 4 surface and the resin molded body 3 can be acquired thereby no gap being formed in the interface between them so that the water content, etc., on the chip surface may be sucked through the dummy bonding wires 1 to be diffused in the resin molded body 3.</p> |
